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記憶體散熱片

  記憶體散熱片(DDR HEATSINK),貼附在記憶體上增加排除熱能效率,屬於被動性散熱元件,材料以導熱性佳,質量輕,容易加工的金屬。 依據客戶不同需求,提供攻牙、噴砂、雷雕、印刷與鑽切的後製程加工服務。

CT HEATSINK with PAD
for DDR4

126 x 25 x 0.8 mm (Single)
NO.4020234
Material : Aluminum
Process : Stamping

CT HEATSINK with PAD
for DDR4

127 x 26.7 x 6.3 mm
NO.4020289
Material : Aluminum
Process : Stamping

CT HEATSINK with PAD
for DDR4

126 x 25 x 0.8 mm (single)
NO.4020144
Material : Aluminum
Process : Stamping

CT HEATSINK with PAD
for DDR4

126 x 26.6 x 6.8 mm
NO.4020032
Material : Aluminum
Process : Stamping

CT VLP-R-DIMM with PAD
for DDR3

127 x 14.35 x 5.8 mm
NO.4150010A
Material : Aluminum
Process : Stamping

CT LR-DIMM with PAD
for DDR3 / DDR4

131.75 x 25.65 x 6.17 mm
NO. TOP 315040012 / BTM 315040013
Material : Aluminum
Process : Stamping

CT FB-DIMM with PAD
for DDR3 / DDR4

127 x 22 x 7 mm
NO. TOP 305040010 / BTM 305040011
Material : Aluminum
Process : Stamping

CT FB-DIMM with PAD

69.2 x 24.94 x 3.9 mm
NO.4030015
Material : Aluminum
Process : Stamping

CT SO-DIMM with PAD

71.3 x 24.5 x 4.42 mm
NO.4030030
Material : Aluminum
Process : Stamping

Address: 5F. No.14, Wugong 5th Rd., Wugu Dist., New Taipei City 248-90, Taiwan (R.O.C.)

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